12/18/08

New Solder Pallet Material Introduced for Extreme Soldering Applications

Electrolock Incorporated, a designer and manufacturer of high-performance materials for the PCB tooling and assembly industry, recently introduced a new, ROHS-compliant solder pallet material that offers electronic contract manufacturers and fabricators distinct advantages in comparison with conventional solder pallet materials. This new solder pallet material was designed with these extreme processing applications in mind. Electrolock-XP materials are molded under very high pressure. This molding process provides a lower profile surface that is chemically inert and resistant to high temperatures.

Manufactured in the USA using an patent-pending molding and processing technology, Electrolock-XP materials meet today's demanding flatness and thickness requirements without surface grinding, and have been proven to sustain over 12,000 cycles of operation with virtually no surface degradation.

Electrolock-XP is a better solder pallet material offering EMS manufacturers, as well as fabricators, increased control over the quality of their soldering processes by providing greater resistance to extreme conditions and corrosion. This new material is setting a new standard for durable soldering performance. Electrolock-XP reduces downtime, eliminates the need for sanding, expands soldering capabilities, and provides a smooth, chemically inert surface that enables intricate circuit designs.

Electrolock-XP pallets are compatible with both lead free solder and halide flux systems and can be used as carriers in wave solder and SMT processing applications. These applications include lead-free soldering, conformal coating and composite tooling.

These new solder pallets will provide EMS manufacturers and fabricators with improved quality control of their soldering processes, reduced downtime, improved product quality and reduced operating costs.

Inventor of New Solder Pallet Material

Richard A. Reed has been researching, developing and commercializing industrial materials for more than 20 years. With an MBA in innovation and technology, BS in industrial management from Myers University, AS in chemistry from Thiel College as well as leadership and marketing training from the Weatherhead School of Management of Case Western Reserve University, he is an industry expert in reinforced plastics and high performance polymeric materials. Richard is the business unit manager responsible for the development of the new Electrolock-XP solder pallet material. Based on this expertise, Richard is available for interviews, presentations as well as technical articles.

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