1/7/09

Electrolock Exhibiting at the IPC APEX EXPO

Electrolock Incorporated will be part of the 2009 IPC APEX EXPO at the Mandalay Bay Hotel & Convention Center in Las Vegas from March 31st-April 2nd. Electrolock will be introducing two new products for the PCB industry.
Come see us for information about the next big thing in the PCB industry!

12/18/08

New Solder Pallet Material Introduced for Extreme Soldering Applications

Electrolock Incorporated, a designer and manufacturer of high-performance materials for the PCB tooling and assembly industry, recently introduced a new, ROHS-compliant solder pallet material that offers electronic contract manufacturers and fabricators distinct advantages in comparison with conventional solder pallet materials.  More

10/10/08

Premature Degradation of Conventional Solder Pallet Materials

It has been brought to our attention that a number of CM's have been dissatisfied with the performance of conventional solder pallet materials. Specifically they are unhappy with the premature degradation of the conventional materials especially in systems that use Adipic Acid, Halides and/or Alcohol in their fluxes.  More

Request A Sample | Back to top